Slink® EP-147 低溫快速硬化環氧膠

Slink® EP-147 低溫快速硬化環氧膠

100 ℃, 5分鐘快速固化 (80 ℃, 20-25分鐘). 高抗張強度/結構性接著披覆. 高硬度. 通過SGS RoHs 及鹵素檢驗. 絕緣/抗電壓. 低固化收縮率. 優越的耐化學品抗蝕能力.

Slink® EP-147  Low temperature cure Epoxy Adhesive

(原 EP-6231 updated)

PRODUCT DESCRIPTION

Slink® EP-147 is single component, low temperature thermal curable epoxy adhesive for structural bonding of metals and composite. Product formulate with high tensile shear strength and excellent adhesion on  Aluminum, stainless steel, copper, PCB, ceramic and some plastics.

PHYSICAL PROPERTIES

Appearance

Black

Chemical base

Epoxy Resin

Specific Gravity [g/cm³]

Approx. 1.18

Flash Point [] (TCC)

> 200

Viscosity [cps] at 23°C

3,000~5,000cp

Solvent

None

Odor

Low

CURE CONDITIONS

Temp.

80

90

100

time

min.

15~25

10-15

5-8

CURED PERFORMANCE

Data base on Cure condition : 30min. 120℃ ; test at 25℃

Elongation at tear [%]

< 8%

Shore hardness

86D

Shear Strength (ASTM D-4501)

> 20 N/mm2

Temperature range for use

-55 to +150 °C

Coefficient of thermal expansion (ASTM D696)

60x10-6

Water absorption [%] (ASTM D570)

<0.8%

Surface resistance [W] (ASTM D149)

1.9x108

Dielectric strength [kV/m]

27.3

MECHANICAL STRENGTH

Cure by oven bake at 120℃ for 30min. Controlled bonding gap 0.10 mm, substrates Abraded and wiped by IPA, Shear Strength Test on 24 hours after bonding.

Joint parts material

Shear Strength

Aluminum alloy

25~28 N/mm2

Steel

21~22 N/mm2

Stainless steel

21~22 N/mm2

Zine plated steel

25~28 N/mm2

Brass

26~30 N/mm2

FR4

16~19 N/mm2

STORAGE

Slink® EP-147 is heat sensitive product, store in 0~4. Avoid contact with amine, strong oxidizing agents, strong acids and strong bases. Do not expose on sunlight directly. Improper storage may result in slow curing and possible thicken of adhesive.

SHELF LIFE

6 months in original package and store in 0~4  .

PACKAGES

30ml dispensing syringe

1 Kg container